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TLP185 (GR-TPR,E) Toshiba Semiconductor and Storage

2016/4/27
           

TLP185

TLP185

The TOSHIBA mini flat coupler TLP185 is a small outline coupler, suitable for

surface mount assembly.

TLP185 consists of a photo transistor optically coupled to a gallium arsenide

infrared emitting diode. Since TLP185 is smaller than DIP package, it’s

suitable for high-density surface mounting applications such as

programmable controllers.

TLP185

• Collector−emitter voltage: 80 V (min)

• Current transfer ratio: 50 % (min)

Rank GB: 100% (min)

• Isolation voltage: 3750 Vrms (min)

• Operation Temperature:-55 to 110 ˚C

• Safety Standards

UL approved: UL1577, File No. E67349

cUL approved: CSA Component Acceptance Service No. 5A

File No.E67349

• BSI approved: BS EN60065:2002, Certificate No. 9020

BS EN60950-1:2006, Certificate No. 9021

• Option (V4) type

VDE approved: EN60747-5-2, Certificate No. 40009347

(Note): When a EN60747-5-2 approved type is needed,

Please designate “Option(V4)”

• Construction mechanical rating

Creepage distance : 5.0 mm (min)

Clearance : 5.0 mm (min)

Insulation thickness : 0.4 mm (min)

 

 

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