TLP185
The TOSHIBA mini flat coupler TLP185 is a small outline coupler, suitable for
surface mount assembly.
TLP185 consists of a photo transistor optically coupled to a gallium arsenide
infrared emitting diode. Since TLP185 is smaller than DIP package, it’s
suitable for high-density surface mounting applications such as
programmable controllers.
• Collector−emitter voltage: 80 V (min)
• Current transfer ratio: 50 % (min)
Rank GB: 100% (min)
• Isolation voltage: 3750 Vrms (min)
• Operation Temperature:-55 to 110 ˚C
• Safety Standards
UL approved: UL1577, File No. E67349
cUL approved: CSA Component Acceptance Service No. 5A
File No.E67349
• BSI approved: BS EN60065:2002, Certificate No. 9020
BS EN60950-1:2006, Certificate No. 9021
• Option (V4) type
VDE approved: EN60747-5-2, Certificate No. 40009347
(Note): When a EN60747-5-2 approved type is needed,
Please designate “Option(V4)”
• Construction mechanical rating
Creepage distance : 5.0 mm (min)
Clearance : 5.0 mm (min)
Insulation thickness : 0.4 mm (min)
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