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Aries Electronics 18-3518-10
PartNo:

18-3518-10
Manufacturers: Aries Electronics
Qty: 1593
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Description: CONN IC DIP SOCKET 18POS GOLD
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Product Information:
Packaging:Bulk
Series:518
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10μin (0.25μm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200μin (5.08μm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-
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