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Omron Electronics Inc-EMC Div XR2A-1401-N
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XR2A-1401-N
Manufacturers: Omron Electronics Inc-EMC Div
Qty: 198
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Description: CONN IC DIP SOCKET 14POS GOLD
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Product Information:
Packaging:Bulk
Series:XR2
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):14 (2 x 7)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:29.5μin (0.75μm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Open Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:29.5μin (0.75μm)
Contact Material - Post:Beryllium Copper
Housing Material:Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature:-55°C ~ 125°C
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