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Aries Electronics (28-516-11)
PartNo:
28-516-11
Manufacturers:
Aries Electronics
Qty:
274
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Description:
CONN IC DIP SOCKET ZIF 28POS GLD
PDF:
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Product Information:
Packaging:
Bulk
Series:
516
Type:
DIP, ZIF (ZIP)
Number of Positions or Pins (Grid):
28 (2 x 14)
Pitch - Mating:
0.100" (2.54mm)
Contact Finish - Mating:
Gold
Contact Finish Thickness - Mating:
10μin (0.25μm)
Contact Material - Mating:
Beryllium Copper
Mounting Type:
Through Hole
Features:
Closed Frame
Termination:
Solder
Pitch - Post:
0.100" (2.54mm)
Contact Finish - Post:
Gold
Contact Finish Thickness - Post:
10μin (0.25μm)
Contact Material - Post:
Beryllium Copper
Housing Material:
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:
-
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