DILB14P-223TLF
14 Position 2.54 mm Pitch Open Frame Through Hole DIP Socket
Key specifications
- Part Number
- DILB14P-223TLF
- Manufacturer
- Amphenol Communications Solutions
- Category
- Sockets for ICs, Transistors
- Lead Time
- 11 Weeks
- RoHS
- REACH
- Datasheet
- Pricing
- $0.3060 – $0.3810
Product Attributes
- Type
- DIP, 0.3" (7.62mm) Row Spacing
- Package
- Tube
- Features
- Open Frame
- Packaging
- Tube
- Termination
- Solder
- Pitch - Post
- 0.100" (2.54mm)
- Mounting Type
- Through Hole
- Current Rating
- 1A
- Pitch - Mating
- 0.100" (2.54mm)
- Housing Material
- Polyamide (PA), Nylon
- Contact Resistance
- 30 mOhm
- Contact Finish - Post
- Tin
- Operating Temperature
- -55°C ~ 105°C
- Contact Finish - Mating
- Tin
- Contact Material - Post
- Copper Alloy
- Termination Post Length
- 0.124" (3.15mm)
- Contact Material - Mating
- Copper Alloy
- Material Flammability Rating
- UL94 V-0
- Contact Finish Thickness - Post
- 100.0in (2.54m)
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Contact Finish Thickness - Mating
- 100.0in (2.54m)
- Number of Positions or Pins (Grid)
- 14 (2 x 7)
Product support
- What is the MOQ for DILB14P-223TLF?
- Minimum order quantity is 1 units.
- How do I get pricing?
- Submit an RFQ or contact our sales team for volume pricing and lead times.
- Is this part RoHS compliant?
- Yes, this part is RoHS compliant.