CXDA Electronics
On-Shore Technology, Inc.

BU200Z-178-HT

CONN IC DIP SOCKET 20POS GOLD

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Key specifications

Part Number
BU200Z-178-HT
Category
Sockets for ICs, Transistors
Lead Time
12 Weeks
RoHS
REACH
Pricing
$3.1010 – $3.6900

Product Attributes

Type
DIP, 0.3" (7.62mm) Row Spacing
Series
BU-178HT
Package
Tube
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Pitch - Mating
0.100" (2.54mm)
Contact Resistance
7 mOhm
Contact Finish - Post
Copper
Operating Temperature
-55°C ~ 125°C
Contact Finish - Mating
Gold
Contact Material - Post
Brass
Termination Post Length
0.059" (1.50mm)
Contact Material - Mating
Beryllium Copper
Material Flammability Rating
UL94 V-0
Contact Finish Thickness - Post
Flash
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Contact Finish Thickness - Mating
78.7in (2.00m)
Number of Positions or Pins (Grid)
20 (2 x 10)

Product support

What is the MOQ for BU200Z-178-HT?
Minimum order quantity is 1 units.
How do I get pricing?
Submit an RFQ or contact our sales team for volume pricing and lead times.
Is this part RoHS compliant?
Yes, this part is RoHS compliant.

Need a custom quote?

Submit an RFQ and our sales team will review the details.

Request a Quote