CXDA Electronics
Preci-Dip

558-10-255M16-001104

BGA SURFACE MOUNT 1.27MM

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Key specifications

Part Number
558-10-255M16-001104
Manufacturer
Preci-Dip
Category
Sockets for ICs, Transistors
Lead Time
8 Weeks
RoHS
REACH
Pricing
$81.4980

Product Attributes

Type
BGA
Series
558
Package
Bulk
Features
Closed Frame
Packaging
Bulk
Termination
Solder
Pitch - Post
0.050" (1.27mm)
Mounting Type
Surface Mount
Current Rating
1A
Pitch - Mating
0.050" (1.27mm)
Housing Material
FR4 Epoxy Glass
Contact Resistance
10 mOhm
Contact Finish - Post
Gold
Operating Temperature
-55°C ~ 125°C
Contact Finish - Mating
Gold
Contact Material - Post
Brass
Termination Post Length
0.086" (2.20mm)
Contact Material - Mating
Brass
Material Flammability Rating
UL94 V-0
Contact Finish Thickness - Post
10.0in (0.25m)
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Contact Finish Thickness - Mating
10.0in (0.25m)
Number of Positions or Pins (Grid)
255 (16 x 16)

Product support

What is the MOQ for 558-10-255M16-001104?
Minimum order quantity is 1 units.
How do I get pricing?
Submit an RFQ or contact our sales team for volume pricing and lead times.
Is this part RoHS compliant?
Yes, this part is RoHS compliant.

Need a custom quote?

Submit an RFQ and our sales team will review the details.

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